TECHGuru

  In the manufacturing process of electronics, integrated circuit (IC) packaging is one of the major stages of semiconductor device fabrication in which the small blocks of semiconducting material is encapsulated in a supporting case that prevents physical corrosion and damage. The market is segmented into by application which includes LED, sensors and MEMS, logic, optoelectronics and imaging, memory, among others. The market, by region is segmented into Asia Pacific, North America, Europe, Middle East and Africa and South America. Lower cost, low power consumption, high speed signal processing and small form factors are some of the prime reasons behind the growing application of 2.5D packaging in smartphone and memory chips. Additionally, high thermal performance is another major feature which is fueling the market for 2.5D integrated circuit packaging globally. In order to increase the efficiency and to cut down the power consumption up to 50%, the usage of 2.5D IC packaging tec...