TECHGuru

  Global Thin Wafer Processing and Dicing Equipment Market: Snapshot The recent increase in the demand for portable communication devices, such as smartphones, memory cards, smart card, and various computing devices has boosted the global  thin wafer processing and dicing equipment market substantially. In 2015, the global market for thin wafer processing and dicing equipment garnered US$388.9 mn in revenues, which, with an expected CAGR of 6.80% between 2016 and 2024, is likely to increase to US$692.5 mn by the end of 2024. The rising awareness about the attributes and benefits of thin wafer processing and dicing equipment, such as better electrical performance and reduced production cost of the device, is likely to support the growth of this market significantly over the next few years. Although Demand for Blade Dicing to Remain High, Laser Dicing to Emerge more Lucrative Blade dicing, plasma dicing, and laser dicing are the three main dicing technologies utilized in wafer ...