TECHGuru

  Chip-On-Flex or COF is a semiconductor assembly technology in which the die is mounted directly on the flexible substrate circuit board as against the traditional printed circuit boards, along with electrical connections. Chip-On-Flex offers multiple advantages over the printed circuit boards such as reduced weight, compact size, high reliability and lower production cost. Flexible reinforced boards, semi-flexible boards and rigid flexible boards are the different types of substrates used for Chip-On-Flex. Market Dynamics: Global Chip-On-Flex (COF) Market The Chip-On-Flex market is primarily driven by the increased demand for adaptive and miniaturized components in wide range of applications. Another factor complimenting the growth of global Chip-On-Flex market is the increasing demand of flexible batteries. Flexible batteries is a major application of Chip-On-Flex technology which is expected to witness prominent growth in during the forecast period. Additionally, the increasin...